![]() This reduces thermal stress on the board compared to heating up just one spot all the way from room temperature. Hot plates and hot-air soldering stations also work together very well: the hot plate can be used to pre-heat the entire board to about 150 ☌, with the hot air gun used on just the part to be soldered. Professional hot-air stations can run into thousands of dollars, but you can buy lower-range models, with adjustable temperature and airflow, for between $100 and $300. For that, a hot-air soldering station is the tool to use. A hot air soldering station should have adjustable temperature and airflow, as well as nozzles of various sizes.Ī drawback of hot plates is the fact that they heat up the entire board at once, making them less than ideal if you want to solder or desolder a single component. They’re pretty easy to use, too: simply place your board on top, set the desired temperature and wait for the solder to work its magic. Also known as “pre-heaters”, these can be had for less than $100 from the usual online channels. Although you can convert cooking appliances into soldering hot plates, it’s more convenient to buy one specifically made for the purpose with an adjustable temperature controller. Sold under many different names, a simple hot plate like this is a useful tool for basic SMD reflow work.Ī smaller, cheaper and arguably more versatile tool is a hot plate. Reflow ovens are great for small-scale series production, but not so much for repairs or rework. While you can buy reflow ovens small enough to place in your workshop (or even build them yourself), they will always take up quite a bit of space. Tools of the Tradeįor large-scale production, whether for BGA-based designs or any other kind of SMD work, reflow ovens are the tool of choice. Today, we’ll explore how to get those chips on our board, and how to take them off again, without spending a fortune on equipment. Not so for BGAs: we’ll need to bring out some specialized tools to solder them correctly. If you’ve got some experience with SMD soldering, you’ll find that any SOIC, TQFP or even QFN package can be soldered with a fine-tipped iron and a bit of practice. But designing a board is one thing – soldering those chips onto the board is quite another. So I would fully expect having to heat the board more than what the profile says.In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. And unlike in an oven, where you have fairly insulated environment with little/no drafts and heating is done from multiple directions, with a hotplate you are heating only from the bottom - and the component leads/pins may not be hot enough yet, resulting in a cold joint, despite the paste having melted already. You don't care only that the paste melts but also that it properly wets the surfaces it is supposed to join. I was just hoping to know that before hand. From that perspective the datasheet is applicable and 1:1 hot plate vs reflow oven. Some experimentation found that the solder paste melted nearly at the exact temperature of the melting point in the chart above. People do this even with kitchen skillets with no temperature control at all. RF, PLC, CAD, HW Startups, Robotics, Microcomputing, DIY Audio, DIY Gear, DIY, Mindstorms, ASM, EE Books, Product Design, LabVIEW, Breadboard, RTLSDR, Manufacturing, Electronic Circuits.Ī hot plate definitely has temperature control within 10 degrees.ĭepends, you didn't say what kind you have. ![]() AskElectronics, Electronics, ECE, RPi, NiceChips, DevKit, Arduino, micro:bit, Nucleo, STM32F4, MSP430, PSoC, ARM, Amp Hour, FPGA, DSP,.How to solder: SMD Resistors, SMD ICs, SMD QFP IC, SMD Drag Solder, SMD Tips, 1980 Soldering Videos.Gerbv, GerberLogix, DFM Now, ViewMate, ZofzPCB, GC-Prevue. Pro ($$$$): Altium, Allegro, OrCAD, PADS, Xpedition. ![]()
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